HFP-612 PREALIGNER G2 · He-Five Documentation

Intorduction #

High precision prealigners designed to accompany semiconductor wafer handlers. The prealigner determines the center of the wafer and the orientation of the fiducial and positions the wafer for handling.

Features #

Compact design
Highly repeatable
Intelligent commands
Fast-scan high-throughout option available
Alignment cycle time of less than four seconds
Class 1 clean-room environment capability

Specification #

Input Voltage Range
- 24VDC
Wafer Sizes
- HFP-812 - 200mm, 300mm
- HFP-312 - 3", 100mm, 125mm, 200mm, 300mm
Operating Temperature
- 50ºF to 104ºF
- 10ºC to 40ºC
Servo Axes
- HFP-612 - Three Axes
Axes of Motion
- Radial - X/Y Offset
- Theta - Rotate Chuck
- Z - Raise/Lower Pins
Detection
- Optical, Non-contact
Flat & Notch Compatibility
- Entire SEMI Range
Reliability
- MTBF > 65000 hours

Interfacing #

Mounting Surface
- Mounting Screws
- Leveling Screws
- See Appendix A for Layout
I/O Panel
- All connectors on panel.
- Vacuum Fittings too.
Communication Protocol
- ASCII Based RS-232
Power Requirements
- 24 VDC
- 2 Amp.

Compliances #

Safety - Semi S2
Cleanliness - ISO Class 1 (At substrate handling level.)

Maintenance #

Operating Environment
- Ambient Temperature - ##°C to ##°C (##°F to ##°F)
- Humidity - 5% to 90% non-condensing
Storage/Transportation
- Temperature - ##°C to ##°C
- Humidity - 5% to 90% non-condensing
- Equipment should be shipped and stored in manufacturer-supplied packaging.
- Must always be stored or shipped upright in a clean, dry, condensation free environment.
Recovering from EMO
- Restore secure environment.
- Restore power to motors.
- Enable Servo.
Maintenance Parts List
- TBD